While the speed of Intel and AMD processors has increased at an amazing rate, so has the heat generated from these processors. Fortunately, Vantec's R&D department keeps creating new, innovative technologies to fill the market needs and provide quality thermal solutions. Traditional heatsinks are designed with cross-sectional fins, limiting the removal of the hot air generated from the CPU to only two sides of the heatsink. Unlike other heatsinks, the AeroFlow has a copper-core center that quickly absorbs the heat from the CPU. The AeroFlow is also designed with unique, four-sided aluminum fins that slope inside the heatsink, smoothly removing the heat from the center of the heatsink and allowing air to flow through all four sides. This ensures that heat is removed evenly throughout the entire processor, creating an exclusive cooling system that can only be called AeroFlow.
AeroFlow Heat Sink Design.
TMD (Tip-Magnetic Driving) Fan
Copper Core for superior heat dissipation
Fan Speed(RPM): 5600
Noise Level(dBA): 38.0