Following the recent release of the award winning MCX462-V™ model, which defined an entirely new class of high-performance and low noise heatsinks, we are now proud to introduce the MCX603-V™ heatsink for Intel® Xeon™ processors.
The MCX603-V™ heatsink is of equal size and pin design to the MCX462-V™, thus features identical performance and usage specifications as outlined below:
Optimized performance characteristics at the lowest possible audible noise levels.
Full compatibility with all Intel® Xeon retention systems, thanks to two different retention solutions:
Plug-and-play installation with Intel's validated retention mechanisms for OEM processors (does not necessitate removal of the motherboard for installation).
Optional screw/spring assembly retention system (requires removal of the motherboard for installation).
Hybrid copper base, thin aluminum pin heatsink: the massive 1/2" thick copper base provides superior heat capacity for unparalleled stability in extreme overclocking applications. The thin aluminum pins promote increased turbulence for more efficient heat dissipation compared to traditional fin extrusions.
Patented Helicoid pin design (U.S. patent 6,469,898): pins are individually machined in an helicoid shape, to increase their surface area, and further enhance heat dissipation efficiency.
Several patents pending for concentrically aligned rows of pins, bent at multiple angles. The spacing and angles between the concentric rows has been precisely calculated to optimize cooling and reduce noise at air flow levels as low as 22 CFM and 23 dbA.