44 x 44 x 5 mm of Copper Plate
Contrary to heat sinks which use a copper core (copper poured inside aluminium), for the Copper Silent 2 we use more material over the DIE where high energy flows (copper plate) and in the external areas where low energy flows, less material (only 5mm aluminium plate). Thus we achieve a better efficiency, hence better cooling performance without increasing the weight.
Tin Connection between Copper and Aluminium
The heat transfer of conventional copper cores onto aluminium is ensured by thermal compound, which transfers the warmth extremely poorly compared to metals. In contrast to this we use a super-thin tin film. This has the advantage of approx. 25-times higher heat conductivity of tin compared with the thermal compound.
Compared to the Copper Silent the cooling performance was improved, without increasing the height of the heatsink or violating the height restriction area defined by AMD. Thus compatibility is guaranteed for all Socket A mainboards. Thanks to the reversed fan mounting, the relevant airflow height of 56mm is kept low.
The Second Revision of the Copper Silent 2 allowed for the ventilationsyste.......
(Read Entire Description)